By exploiting the manufacturing of semiconductor producing equipment and the know-how of research and development technology, we promote the manufacturing of the producing equipment exclusive to micro-machines and the research & development of process technology.
KOH anisotropic etching system
KOH process superior to anisotropic etching is provided by the specification specialized in MEMS.
The space saving and low cost can be achieved by downsizing to the equipment size suitable for MEMS process.
Anodic bonding system for micro-machine
It is an all-in-one system of consistent processing in vacuum from the alignment to the bonding. The substrate treatment of alignment part is the plasma cleaning.
(Substrate compatible to ำ4 inch to ำ6 inch)
Electroplating treatment system
The through tube and deep ditch of the glass
substrate and Si up to 6 inch in maximum are given the embedding
plating such as Cu and Ni. Our original know-how had achieved
the amount of plating on the substrate surface uniform. (Source
of original development: MEMS CORE Corporation)