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Wet treatment system
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| We deliver various wet treatment system including
the wet etching system, wet cleaning system and lift-off system. |
Contamination extraction system |
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| SA-800 |
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| By placing solution (stilliform) on the substrate,
the solution location is monitored by camera and the solution
is scanned in helical shape at the 3D action table. The contaminant
will be collected as solution but is also capable of drying
it on the substrate by halogen lamp. |
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Single wafer dual-side cleaning system |
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| HU-8000 |
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The simultaneous cleaning for both side of
wafer is capable. Also, high cleaning capability is exerted
for the fine structural part.
(Substrate adaptable to ำ8 inch to ำ12 inch) |
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Single wafer lift-off system |
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| L-700 |
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The single wafer lift-off system adopting
spin & spray in place of ultrasonic wave. Although the
physical ability is inferior to the ultrasonic wave, it is
highly valued in that the pattern that should remain is free
from any flaw without producing finer peeling membrane.
(Substrate adaptable to ำ2 inch to ำ4 inch) |
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RCA wet- and UV cleaning / complex system |
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| TCU-5000 |
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| It is an ideal complex cleaning
system capable of eliminating contaminant by organic cleaning
at the first step and the precise dry cleaning by UV ozone
at the second step. |
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