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Etching system |
| Whether it's wet etching or dry etching, the abundant technology and system are provided to respond to a wide variety of usage. |
Fully-automated etching system |
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| L-05 |
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| The wet etching process is automated and the single-wafer processing method is adopted. It is suitable for the recess etching for GaAs wafer and the metal membrane etching for the thin-film magnetic head.
The organic cleaning is also available.
(Substrate compatible to φ4 inch to φ6 inch)
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Multipurpose etching system
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| CM-600 |
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By selecting option, it has expandability of handling from chemical etching to the plasma etching. It can be used for experiment equipments and jobbing production facilities.
(Option specification)
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Dry etching system for compound semiconductors |
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| RDE-150 |
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| The chemical dry etching system for wide-gap compound semiconductors such as GaN, SiＣand ZnO. |
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Multi-electrode dry etching system |
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| SR-1000 |
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It is a dry etching system of multiple electrode type that can even cope with the enlarging area. The optimization of oscillation frequency enabled the multiple electrodes. By optimizing power, it can also function as the ashing, cleaning and texturing system.
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